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Our ISO : certified Materials Division stocks a vast assortment of high purity materials, evaporation sources, and crucible liners for use in both thermal and E-beam evaporation as well as sputter deposition processes. We offer pure elements, compounds, alloys, ceramics, intermetallics, and mixtures in a variety of shapes, sizes, and purities for both R&D and Production applications. Each sputtering target and evaporation material ships complete with a Certificate of Analysis and SDS. We also provide in-house sputter target bonding and precious metals reclamation services, saving you both time and money.
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For a listing of Frequently Asked Questions (FAQs) about Deposition Materials please see this link: Deposition Materials FAQ.
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Diode Sputtering
In diode sputtering, an electric potential difference is applied between the target and the substrate to form a plasma discharge inside a low vacuum chamber. The free electrons in the plasma are immediately removed from the negative potential electrode (cathode). These accelerating electrons collide with neutral gas atoms (Argon) in their path, causing the electrons in the shell of these atoms to separate. As a result, the gas atoms become positive ions and accelerate towards the cathode, causing the sputtering phenomenon. Glow discharge occurs when some of the positive ions return to their ground state by adsorbing free electrons and releasing photons.
This mechanism is called Diode Sputtering and the applied voltage can be DC (with constant poles) or RF (with alternating poles), depending on the target material. One of the problems with this method is that its coating rate is low and it takes longer to do the coating, which causes the target to heat up and damage its atomic structure, which is improved utilizing Magnetron Cathodes.
Contact us to discuss your requirements of rotary sputter target. Our experienced sales team can help you identify the options that best suit your needs.