Sputtering deposition is one of the most common processes used for thin film deposition: the coating of a surface with a layer of material ranging from fractions of a nanometer to several micrometers in thickness. Thin film deposition is essential to manufacturing of many modern electronic and optical components
For more information, please visit our website.
Sputtering deposition uses a plasma, usually formed from a non-reactive gas, to bombard a target---a source of the material to be deposited as a thin film---and knock the atoms of the target material out of its bulk. The ejected atoms then land on the substrate and form a thin film. Since the target does not need to be heated, the technique is very flexible for a wide range of applications. Targets can be composed of pure elements as well as compounds or mixtures.
INNOVATION CASE STUDIES
Our standard target sizes range from 1" to 8" in diameter and from 2mm to 1/2" thick. We can also provide targets outside this range in addition to just about any size rectangular, annular, or oval-shaped target. Other shapes are available by request.
For large area thin film deposition, American Elements produces rotatable sputtering targets via casting or plasma deposition onto a tubular substrate. Rotatable sputtering targets are available up to 1,000 mm in length and can be produced from a number of single element, oxide and alloy materials for use in many applications where large film areas are required, such as photovoltaic device fabrication. All machined pieces are produced by casting oversized blanks, and machining down to required specifications. They are usually machined to tolerances of +0.010"/-0" on diameter, length or width, and +/-0.005" on thickness. Larger targets are also finished to a flatness within 0.015". We can accommodate tighter tolerances upon request.
American Elements casts any of the rare earth metals and most other advanced material into rod, bar or plate form, as well as other machined shapes. All as-cast rods, bars and plates are produced from either the pure metal Ingots or sublimed metals. We have a variety of standard sized rod molds, from a minimum of 1/4" diameter up to 3" diameter for most rod needs. Plates are also offered in standard thicknesses, from 1/4" thick to 1" thick. Maximum rod lengths and maximum plate sizes are dependent on melt capacity and furnace room. Small diameter rods may have only a 4"-6" maximum cast length, whereas larger diameter rods may be cast up to about 16" long. Plate sizes can be cast up to a size of 24" x 16". As-cast rods or plates are saw-cut to length or final dimensions, and the metal surface may have visible flow marks.
Representative Image
Acetron Product Page
Our comprehensive offering of sputtering targets, evaporation sources and other deposition materials is listed by material throughout the website. Below you will find budgetary pricing for sputtering targets and deposition materials per your requirements. Actual prices may vary due to market fluctuations. To speak to someone directly about current pricing or for a quote on sputtering targets and other deposition products not listed, please click here.
* This is a recommendation based on our experience running these materials in KJLC guns. The ratings are based on unbonded targets and are material specific. Bonded targets should be run at lower powers to prevent bonding failures. Bonded targets should be run at 20 Watts/Square Inch or lower, depending on the material.
* Suggested maximum power densities are based on using a sputter up orientation with optimal thermal transfer from target to the sputter cathode cooling well. Using other sputtering orientations or if there is a poor thermal interface between target to sputter cathode cooling well may require a reduction in suggested maximum power density and/or application of a thermal transfer paste. Please contact for specific power recommendations.
** The z-ratio is unknown. Therefore, we recommend using 1.00 or an experimentally determined value. Please click here for instructions on how to determine this value.
Z-Factors
Empirical Determination of Z-Factor
Unfortunately, Z Factor and Shear Modulus are not readily available for many materials. In this case, the Z-Factor can also be determined empirically using the following method:
Another alternative is to change crystals frequently and ignore the error. The graph below shows the % Error in Rate/Thickness from using the wrong Z Factor. For a crystal with 90% life, the error is negligible for even large errors in the programmed versus actual Z Factor.
Notes:is recommended for these materials. Many materials have characteristics which are not amenable to sputtering, such as, brittleness and low thermal conductivity. Request more information, please click here
This material may require specialandprocedures. This process may not be necessary with other materials. Targets that have a low thermal conductivity are susceptible to thermal shock. Please click here forfor
If you are looking for more details, kindly visit planar sputtering targets.