Aluminum sputtering targets
are used extensively in the
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aerospace, automotive lighting, and
optical industriesdue to their excellent
electrical conductivity,
corrosion resistance, and
reflective properties.
A good understanding of
aluminum sputtering target manufacturing processes and specificationsis essential for quality assurance and efficiency in applications.
With cleaner production methods and careful selection, it is possible to procure high-quality, pure aluminum sputtering targets, which enhance the overall
performance of the thin filmsthey help create.
You must consider several factors when buying aluminum sputtering targets, including
grain size,
purity, and
price.
The
semiconductor industryuses aluminum sputtering targets to create conductive layers in chips and circuitry.
Sputtering targets provide a way to apply a thin material layer
onto a substrate&#; a fundamental process in many industries. One of the most common metals used is
aluminum. Using the right target material is important not only to ensure the quality of the end product but also to optimize efficiency and reduce costs.
Aluminum sputtering targets are mounted onto
vacuum coating machinesto deposit a thin layer of aluminum onto a selected substrate. This directly impacts the performance of the resulting film. Substrates typically include
glass,
silicon, and
metals.
Aluminum sputtering targets have
high purity. They are usually disk-like or planar but can also be columnar, stepped, or custom shaped, depending on requirements. Since they are produced in large quantities, maintaining high quality standards is fundamental. This involves ensuring the appropriate purity levels and focusing on particle formation during the PVD process.
The manufacturing process begins with obtaining high purity aluminum ingots. The ingots undergo a series of treatments, including
forging,
rolling, and
heating, which refine the crystal grains within the ingot. This process increases the density of the target material to suit sputtering requirements.
Care is taken to ensure
high precision and quality, keeping in mind the critical nature of the films the targets will form. After this, the high purity aluminum is processed into the sizes required for the vacuum coater.
Further treatments are applied for enhanced electrical conductivity and corrosion resistance. These treatments include alloying with other metals, like
copper,
chromium,
silver, or
tin, to form an alloy target with boosted properties. This process tailors the targets to suit the specific requirements of different industries.
Today, you can expect finer grain size and improved density in your targets thanks to enhancements in bonding techniques due to modern production technology. This optimization positively impacts the mechanical properties and performance of the end product.
The entire manufacturing process undergoes stringent quality control measures, as the properties of the sputtering target directly affect the performance of the deposited film and play a pivotal role in the product's service life and performance.
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Aluminum sputtering targets
have some specific characteristics. For instance, aluminum has a
melting point of 660 °Cand a vapor pressure of 10-4 Torr at 1,010 °C. Its thermal conductivity is 235 W/m.K.
Property
Specification
Material Type
Aluminum
Symbol
Al
Atomic Weight
26.
Atomic Number
13
Density
2.7 g/cc
Color/Appearance
Silvery, Metallic
Thermal Conductivity
235 W/m.K
Melting Point
660°C
Coefficient of Expansion
23.1 x 10-6/K
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Max Power Density
150 Watts/Square Inch
Under normal conditions, aluminum is light, malleable, ductile, and non-magnetic. It forms a corrosion-resistant
oxide layer, which enhances its applicability in conditions where corrosion resistance is desirable. It&#;s also a good conductor of heat and electricity. As with most metals, the purity of an aluminum sputtering target dramatically affects its conductivity and other properties, hence necessitating high purity levels &#; typically 99.99% or more.
In semiconductor and electronics fabrication, aluminum targets are often used to apply
thin film coatingson surfaces. This takes advantage of the metal's properties to benefit the device operation. Furthermore, aluminum has a low melting point, high thermal and electrical conductivity, and is non-magnetic under
normal conditions, which makes it ideal for these sensitive applications.
The value of aluminum targets comes out when the metal 'sputters': when it is exposed to
evaporation sourcesin a vacuum, the aluminum forms a reflective coating. This feature is useful in
automotive headlamps,
telescopes,
mirror packages, and
toysfor enhancing their light-reflective properties and durability. An industry like OLED, which demands particular optical properties and thermal control, often uses aluminum sputtering targets. In aerospace industries, aluminum targets are used to apply protective coatings that withstand extreme conditions, which contributes to safer and more efficient aircraft operation.
Sourcing aluminum sputtering targets requires several considerations. Key factors include the
target's purity,
grain size,
price, and
delivery conditions. These aspects influence the efficiency of the
sputtering processand the quality of the films produced.
High
purity levelsensure fewer contaminants, leading to smoother finishes and improved performance. Smaller grains enhance the uniformity of deposition, which is important in applications such as chip manufacturing or precision optics. Another critical factor is cost &#; higher purity grades and specialized grain sizes are more expensive. Lastly, it&#;s important to look for a reliable supplier, who will commit to a fast delivery and agree to meet required specifications.
Aluminum sputtering targets have varied applications across different industries. In particular, they are an integral part of the
semiconductor industry, where they serve in the manufacture of conductive layers for chips and circuits. Many everyday commercial products rely on thin film coatings derived from aluminum sputtering targets.
Aluminum Sputtering Targets in the Semiconductor Industry
In the semiconductor industry, the robust electrical conductivity properties of
aluminum sputtering targetsfacilitate the creation of conductive layers in chips and circuitry:
The process supports miniaturization by enabling the precise deposition of thin layers of aluminum. This meets strict specifications for nano-scale semiconductor devices.
Aluminum sputtering targets contribute to the development of integrated circuits by facilitating the formation of the conductive pathways integral to microchip functioning.
The high purity of aluminum sputtering prevents contamination and defects that can lead to chip failures.
In advanced transistors, these targets create a thin barrier layer between copper and silicon.
These frequently-asked questions will help you find the right aluminum sputtering target for you.
For the majority of applications, sputtering target thickness ranges from between 3 to 6 millimeters. However, specific thickness requirements often depend on the application, the type of coating system, and the desired characteristics of the resultant thin film.
To choose the right
aluminum sputtering target, focus on factors such as purity, grain size, dimensions, and cost. A comprehensive understanding of your specific application needs is essential for selecting a target that will suit your process, equipment, and budget.
Suppliers usually ensure quality and purity of their aluminum sputtering targets through documentation that validates the chemical composition and properties of the metal. Moreover, operating under stringent quality control measures during the manufacturing process aids in maintaining a high degree of purity and consistency in the targets.
An aluminum sputtering target is a consistent, reliable, and efficient material for creating high-quality thin films for various substrates. The superior characteristics, such as excellent thermal and electrical conductivity, resistance against corrosion, affordability, and the capability to form an oxide layer resistant to corrosion, make aluminum sputtering targets the preferred choice over other options.
Whether they&#;re enabling the manufacture of high-performance semiconductor devices, contributing to the reflective properties of automotive headlamps, or lending durability to aerospace components, aluminum sputtering targets are providing an essential role behind the scenes. Purchasing these targets involves careful consideration of several aspects, including purity, grain size, price, and delivery conditions. All these directly impact the efficiency of the target.
As technology advances, the demand for improved, customized sputtering targets will continue to rise, driving progress in manufacturing techniques, purity levels, and grain refinement. Investing in high-quality targets is thus crucial: it paves the way for a higher-quality end product while optimizing efficiency and reducing costs.
Shop NowAlthough the rotary targets have developed in recent years, the mainstream shape of the sputtering target is still the planar type. Today let us take a look at the pros and cons of planar targets to help you determine whether a planar sputtering target is suitable for your project.
Simple structure &#; one of the main advantages of the planar target is that the structure is simple. The common planar targets on the market are rectangular planar targets and circular planar targets, which are easily produced by molds. In other words, planar target preparation requires fewer machines and technologies and is easier to prepare. This is why planar targets still dominate the sputtering target market.
Low price &#; You can never deny that the price is always an important competitive factor. As mentioned above, the manufacturing process of the planar sputter target is easier, so its price is much lower than the rotatory sputter target.
Strong versatility &#; Planar sputtering targets usually have strong versatility. Therefore, the transportation of the planar targets is relatively simple and is not easily damaged during transportation.
Good uniformity and repeatability &#; Film layers sputtered by planar targets usually boast good uniformity and repeatability. Planar targets are still best suited for prototype work or elemental experimentation, especially when large amounts of material are not needed at once.
Its biggest disadvantage is the low utilization rate (generally only about 20%). In the sputtering process of the planar target, a strip-shaped pit will be formed when the target of the glow region (the magnetic field distribution region) is consumed to a certain extent, making the target body thinner. And once the pit depth reaches a certain value, the target cannot be utilized anymore. The low utilization rate also reduces its price advantage to some extent.
In conclusion, planar targets are still the best choice for prototype work or elemental experimentation, especially when large amounts of material are not needed at once. But its disadvantage of low utilization rate (20% vs. 80% compared with the rotatory target) does constrain its development.
Next week, let us look at the biggest competitor of the planar target&#; the rotatory target. Weighting the pros and cons of these two types of sputtering target may help you better choose the one for your application.
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