Power Supplies for Semiconductor Equipment

30 Dec.,2024

 

Power Supplies for Semiconductor Equipment

Check now

Semiconductor fabrication applications require dependable power solutions. Let's take a look at the semiconductor fabrication process, the capabilities a power supply unit needs and the industry compliance standards that apply to power supplies for semiconductor equipment. 

A Look Into Semiconductor Fabrication Processes

Semiconductor device fabrication processes have several distinct and intricate steps. Astrodyne TDI's power supplies are essential for every task at the front end and back end of the semiconductor fabrication process:

  • Testing memory: Semiconductor device fabrication processes turn silicon into a thin wafer containing tiny circuits that enable memory functions. They then cut the wafer into individual chips known as dies. Every integrated circuit undergoes testing before wafer fabrication, and then the chips themselves undergo heat testing at high temperatures to ensure they can withstand industrial stresses. Power supplies provide the consistent power necessary for comprehensive testing to take place. 
  • Storage testing: Similarly, semiconductor devices undergo storage testing during fabrication to ensure they can hold sufficient amounts of the correct information. Power supplies provide uninterrupted power for comprehensive evaluation.
  • Ion implantation: Ion implantation requires introducing ions of a particular element into a material to change or refine their properties. In semiconductor equipment fabrication, ion implantation, also known as semiconductor doping, generally involves ions of boron, phosphorus or arsenic. These ions, known as dopants, introduce impurities to modulate the device's electronic properties. A dependable power supply is critical for running the equipment required to create high-energy electron beams for successful ion implantation.
  • Etching: In semiconductor equipment fabrication, wet or dry etching transforms a thin film of material into the wiring and other essential components. Fabricators can coat the film with a photoresist and then project circuit patterns onto it. Etching then removes extraneous material, leaving only the intricate circuit patterns behind. Power supplies provide uninterrupted power for the etching equipment to ensure precision and accuracy. 
  • Deposition: Deposition involves using evaporation or sputtering techniques to create the various metal layers that form electrical connections between cells. Maintaining the uniformity of the deposited material is essential for creating even layers, and power supplies supply the consistent electrical power needed for optimal results.

Choosing the Right Power Supplies for Your Needs 

When you're selecting a power supply, you'll need to consider several important factors to ensure you get the right equipment for your needs. At Astrodyne TDI, our power supply units have the advanced capabilities to give you high performance, exceptional reliability and valuable diagnostic information: 

  • Hold-up time: Power supplies have a certain amount of capacitance that provides about 20 milliseconds of power after a power loss. This hold-up time is the time from the loss of the alternating current (AC) to the time when the output voltage dips below 10% regulation of the maximum set point. The 20-millisecond interval of continued power is enough to keep running the equipment until a generator can switch on. 
  • N+1 redundancy: In a modular power system designed with N+1 redundancy, 1 extra power supply is built into the system. If one of the power supplies fails, the remaining supplies can carry the load until the damaged unit is replaced.
  • Hotswap features: Hotswap features take advantage of that n+1 redundancy to enable part removal for repairs even while the system is still running. With n+1 redundancy, you can pull a power supply out, and the other units will continue to operate as usual. You won't need to turn off the AC input or experience downtime. 
  • Postmortem reporting: Postmortem reporting helps you investigate how and why a failure occurred within the system. If the power supply unit breaks down, you can turn to the postmortem reports to diagnose the issue and determine how to correct it. A good power supply, like the models from Astrodyne TDI, issues warnings and alarms at the first sign that something in the system has gone amiss, and it logs adverse events as they occur. Being able to look at the logs and see that an issue with the grid caused your equipment failure, for instance, gives you valuable information about how to prepare for similar occurrences. 

SEMI F47 Compliant Equipment

What is SEMI F47 compliance? SEMI F47 is an industry standard issued by Semiconductor Equipment and Materials International. It requires power supplies for semiconductor equipment to be immune to certain voltage sags that frequently occur on AC power lines. The standard's most recent version is SEMI F47-.

Performance Criteria

Specifically, SEMI F47 requires power supplies to meet one of two criteria: 

  • Criterion (a): The unit performs at full rated operation, OR
  • Criterion (b): The unit does not perform at full rated operation, but it recovers operation without host controller or operator intervention. It must not send error signals to the host controller to indicate when it does not achieve full rated operation.

During a brownout, the power supply must provide full power at the rated output voltage under these conditions: 

ACE supply professional and honest service.

  • 3.1.8.3.1. 160 VAC for durations up to 1,000 ms (equivalent to 80% of 200V line) &#; criteria (a) for all output conditions.
  • 3.1.8.3.2. 140 VAC for durations up to 500 ms (equivalent to 70% of 200V line) &#; criteria (a) for all output conditions.
  • 3.1.8.3.3. 100 VAC for durations up to 200 ms (equivalent to 50% of 200V line) &#; criteria (a).
  • EN-4-4 electrical fast transient/burst &#; severity level 3.
  • EN-4-5 surge &#; severity level 3.

Reliable power supplies are critical to reducing downtime and avoiding the productivity losses that can cost a company thousands of dollars. Compliance with SEMI F47 provides that reliability and helps minimize costly downtime. 

Design Requirements

Conservative design margins help ensure a long operational life for the power supply. Below are some of the design requirements under SEMI F47: 

  • Electrical design guidelines per NAVMAT PA and NAVSO P-A
  • Reliability prediction and a calculated mean time between failures (MTBF) target of greater than 275,000 hours
  • Design failure mode and effect analysis (DFMEA), including circuit analysis and stress analysis

Test Requirements

A comprehensive test plan ensures the shipment of quality products. SEMI F47 includes these test requirements:

  • First article physical configuration audit 
  • Design verification testing
  • Highly accelerated life testing
  • Manufacturing test and data analysis
  • Production highly accelerated stress screening (to avoid early failures)
  • Fielded product reliability review

Reliable Power Supplies From Astrodyne TDI

When you need power supplies for semiconductor fabrication equipment, trust Astrodyne TDI for dependable solutions. Our power supplies offer superior performance and full compliance with SEMI F47. You'll gain peace of mind knowing you have the continuous power you need to run your equipment efficiently, ensure productivity and avoid downtime expenses.

On the semiconductor equipment market, our power supplies stand apart because of their quality and dependability. Our knowledgeable team also has the experience and industry insights to help you choose the right power supply. Our array of customization options mean you'll get the features and capabilities that best meet your operational needs.

Request a quote today, or contact us to purchase power supplies for semiconductor fabrication equipment.

 

Semiconductor Lead Frame Market - Forecasts from ...

The semiconductor lead frame market is projected to grow at a CAGR of 4.99% to reach US$4.462 billion in from US$3.174 billion in .

A semiconductor lead frame is a small, flat structure made of metal that supports and connects the integrated circuit (IC), discrete devices, and other components in semiconductor devices. The lead frame provides a pathway for electrical signals to pass between the IC and the peripheral environment. They are an essential component in the manufacturing of semiconductor devices as they ensure reliable connectivity and efficient performance. The growth of the semiconductor lead frame market is driven by the increasing demand for electronic devices and the growing trend towards miniaturization of electronic components since the reduction in the size and increasing complexity of electronic devices are creating a high demand for smaller and precise lead frames.

Market Drivers

Increasing use of advanced packaging technologies is driving the market expansion.

The increasing use of advanced packaging technologies, such as wire bonding, is a significant factor driving the growth of the semiconductor lead frame market. Improving the accuracy of wire bonding technology is expected to increase its demand across the semiconductor industry. For instance, in September , Henniker Plasma Company announced a new treatment based on plasma to improve the efficiency of wire bonding technology. In addition, the rising demand for LEDs driven by automotive lighting and other displays is stimulating the demand for semiconductor lead frames as semiconductor lead frames are often used in LED packaging due to their ability to accommodate the precise placement and routing of the wires to ensure the optimal electrical connectivity and performance. For instance, in September , a German-based light solutions manufacturing company, OSRAM Licht AG, introduced lead-frame-based LED lighting components to its Oslon Black Flat S product range used for automotive lighting. Therefore, the rising demand for wire bonding packaging technologies driven by increasing demand for LEDs is expected to drive the semiconductor lead frame market over the forecast period.

By technology, the stamping is expected to hold a prominent market share.

Stamping technology involves pressing a metal sheet or foil against a die to create the desired pattern or shape. It is a fast and cost-effective process that can produce large volumes of lead frames quickly and efficiently and, therefore, is majorly utilized in producing lead frames for consumer electronics such as smartphones and tablets. The rising demand for smartphones and tablets is anticipated to increase the consumption of stamping technology. Further, the stamping technology sector in the semiconductor lead frame market is driven by the demand for high-performance and miniaturized electronic devices and the high demand for lead frames that are small and lightweight to accommodate the precise requirements of various electronic products.

Asia Pacific region held a substantial share in the semiconductor lead frame market

The expansion of the semiconductor industry in different countries in the Asia Pacific region is expected to drive the semiconductor lead frame market as the increasing demand for semiconductors is followed by a rise in demand for various equipment used to manufacture such semiconductors as lead frames. For instance, the semiconductor industry in Taiwan achieved sales revenues of TWD625.53 billion in the third quarter of , according to data released by the World Semiconductor Trade. In addition, the Japanese semiconductor sector, as reported by the International Trade Administration, witnessed a 19.8% rise between and , accounting for nearly 9% of the total world semiconductor production. Further, according to a statement released by the Press Information Bureau of the Indian government in , India&#;s semiconductor market will increase from US$15 billion in to US$63 billion by .

Market Challenge

Alternative availability and the scarcity of semiconductor components remains significant challenge to the market growth.

The increasing use of alternative packaging technologies, such as fan-out wafer-level packaging (FOWLP) and system-in-package (SiP) solutions, is limiting the semiconductor lead frame market growth since these technologies offer several advantages over traditional lead frame-based packaging, such as higher levels of integration and improved thermal performance. For instance, Samsung Electronics announced an investment of US$75 million to deploy fan-out wafer-level packaging at its production facility in Japan in April . Consequently, several semiconductor and electronics companies are shifting from lead frame-based packaging solutions to these alternatives is expected to slow down the market over the forecast period.

In addition, the ongoing shortage of semiconductor components is impacting the semiconductor lead frame market as it is affecting the overall demand for semiconductor devices and the components used to manufacture them, including lead frames. The shortage is rising the prices and increasing production difficulty for certain manufacturers to secure the necessary materials and resources to produce their products.

Product Offerings:

  • Semiconductor lead frame by Toppan Inc. - Toppan Inc., a Japan-based company involved in the printing business, manufactures six different lead frame products, namely Fine Pitch Leadframe, Downset Leadframe, Leadframe with Heat Spreader, Resin Adhesion Improved Package, Caulking Leadframe, and QFN Substrate under its semiconductor package substrates product division to meet the varying needs of different semiconductor processes.
  • Semiconductor lead frame by Advanced Assembly Materials International Ltd. - Advanced Assembly Materials International Ltd., a Hong-Kong-based company offering specialty products to various semiconductor packaging requirements, manufactures lead frames of high-density and cost-effective nature of varying sizes up to 100x300mm as per the specifications of its customers. 
  • Semiconductor lead frame by SDI Group, Inc. - SDI Group Inc., a Taiwanese company generating various specialty scientific products, manufactures three different lead frame types for ICs, discrete/transistors, and other semiconductor chip applications. The discrete lead frames manufactured by the company are extensively adopted in control systems of auto-computers. 

Segmentation:

By Technology

  • Chemical Etching
  • Stamping

By Application

  • Integrated Circuit (IC)
  • Discrete Devices
  • Others

By Geography

  • North America
  • USA
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • Germany
  • France
  • United Kingdom
  • Spain
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Israel
  • Others
  • Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Taiwan
  • Others

A semiconductor lead frame is a small, flat structure made of metal that supports and connects the integrated circuit (IC), discrete devices, and other components in semiconductor devices. The lead frame provides a pathway for electrical signals to pass between the IC and the peripheral environment. They are an essential component in the manufacturing of semiconductor devices as they ensure reliable connectivity and efficient performance. The growth of the semiconductor lead frame market is driven by the increasing demand for electronic devices and the growing trend towards miniaturization of electronic components since the reduction in the size and increasing complexity of electronic devices are creating a high demand for smaller and precise lead frames.The increasing use of advanced packaging technologies, such as wire bonding, is a significant factor driving the growth of the semiconductor lead frame market. Improving the accuracy of wire bonding technology is expected to increase its demand across the semiconductor industry. For instance, in September , Henniker Plasma Company announced a new treatment based on plasma to improve the efficiency of wire bonding technology. In addition, the rising demand for LEDs driven by automotive lighting and other displays is stimulating the demand for semiconductor lead frames as semiconductor lead frames are often used in LED packaging due to their ability to accommodate the precise placement and routing of the wires to ensure the optimal electrical connectivity and performance. For instance, in September , a German-based light solutions manufacturing company, OSRAM Licht AG, introduced lead-frame-based LED lighting components to its Oslon Black Flat S product range used for automotive lighting. Therefore, the rising demand for wire bonding packaging technologies driven by increasing demand for LEDs is expected to drive the semiconductor lead frame market over the forecast period.Stamping technology involves pressing a metal sheet or foil against a die to create the desired pattern or shape. It is a fast and cost-effective process that can produce large volumes of lead frames quickly and efficiently and, therefore, is majorly utilized in producing lead frames for consumer electronics such as smartphones and tablets. The rising demand for smartphones and tablets is anticipated to increase the consumption of stamping technology. Further, the stamping technology sector in the semiconductor lead frame market is driven by the demand for high-performance and miniaturized electronic devices and the high demand for lead frames that are small and lightweight to accommodate the precise requirements of various electronic products.The expansion of the semiconductor industry in different countries in the Asia Pacific region is expected to drive the semiconductor lead frame market as the increasing demand for semiconductors is followed by a rise in demand for various equipment used to manufacture such semiconductors as lead frames. For instance, the semiconductor industry in Taiwan achieved sales revenues of TWD625.53 billion in the third quarter of , according to data released by the World Semiconductor Trade. In addition, the Japanese semiconductor sector, as reported by the International Trade Administration, witnessed a 19.8% rise between and , accounting for nearly 9% of the total world semiconductor production. Further, according to a statement released by the Press Information Bureau of the Indian government in , India&#;s semiconductor market will increase from US$15 billion in to US$63 billion by .The increasing use of alternative packaging technologies, such as fan-out wafer-level packaging (FOWLP) and system-in-package (SiP) solutions, is limiting the semiconductor lead frame market growth since these technologies offer several advantages over traditional lead frame-based packaging, such as higher levels of integration and improved thermal performance. For instance, Samsung Electronics announced an investment of US$75 million to deploy fan-out wafer-level packaging at its production facility in Japan in April . Consequently, several semiconductor and electronics companies are shifting from lead frame-based packaging solutions to these alternatives is expected to slow down the market over the forecast period.In addition, the ongoing shortage of semiconductor components is impacting the semiconductor lead frame market as it is affecting the overall demand for semiconductor devices and the components used to manufacture them, including lead frames. The shortage is rising the prices and increasing production difficulty for certain manufacturers to secure the necessary materials and resources to produce their products.

For more information, please visit Semiconductor Metal Frames.