How to keep impurities out of plating layers
Author:Robby
The key to preventing impurities from entering the plating layer is to take a series of measures to ensure purity and quality control of the plating process. Here are some effective measures:
Pre-plating preparation:
Thoroughly clean the surface of the metal to be plated to remove oil, oxides and other impurities. This can be done by cleaning with an alkaline solution or an acidic solution and pre-treatments, such as activation treatment, to improve the adhesion of the plated layer.
Regularly check the quality and concentration of the plating solution, replenish and adjust it in time to ensure the stability of the plating process and the quality of the plated layer.
Control during plating process:
Precisely control the current density and reasonably adjust it according to the material, shape and size of the metal parts to ensure the plating layer is uniform and dense.
Keep the temperature of plating solution stable to avoid the plating quality problem caused by temperature fluctuation.
Reasonable control of plating time, the plating time required for different metals and plating solutions is different, and needs to be determined according to specific conditions.
Prevent cross contamination:
Avoid solutions or impurities from previous processes being brought into the plating bath, causing contamination of the plating solution. This includes the use of intact hook encapsulation, ensure that the water flow in the cleaning process is sufficient.
Dispose of impurities in a timely manner:
For impurities that have entered the plating solution, it is necessary to clean up in a timely manner to avoid the accumulation of impurities to the extent that they jeopardize the performance of the plating solution and the quality of the plated layer. This includes the use of chemical precipitation, electrolysis and other methods to remove impurities from the plating solution.
Through the above measures, impurities can be effectively prevented from entering the plating layer, thereby ensuring the purity and quality of the plating layer.